Stock # 74927-1 . It is conduction-cooled through the card edge/wedgelock. This GE Fanuc / Radstone PPC2EP-603-5CG VME Conduction Cooled Single Board Computer is new from surplus stock. Aitech Defense. International Journal of Science and Research (IJSR) ISSN: 2319-7064 SJIF (2022): 7. Description: The Model 8006 is a conduction cooled Half-Short ATR chassis with a 4-slot VME 64x or cPCI backplane standard. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. 0 specification for use in. Heat is carried away by the blocks, which consist of the top cover, bottom cover, and wedge Description. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. It is conduction-cooled through the card edge/wedgelock. 1-1997 while providing a low profile, practical packaging solution for high-performance. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. A conduction cooled chassis offers the highest degree of reliability. CompactPCI Serial Chassis. Operating temperature range is -40°C to +85°C. For all rugged environments: Air, Land, and Sea. With moveable rear profiles (up to 2. 100G Ethernet Data plane. 0 specification for use in Mil/Aero VPX systems. The standard model is conduction to wedge lock cooled with an operating temperature range of -40C to +85C and a non-operating range of -55C to +105C. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. 62. 1, 1101. Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. The system is designed with enhanced EMC features. PICMG 2. 11 modular extrusions. Packaged as a single-slot VME module, the conduction-cooled ruggedized C5100-R conforms to the IEEE 1101. Grabcad 3U Vita Card. Description. Architecture: VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. CP949 is a 7-port Ethernet switch in a conduction cooled, single-slot 6U CPCI form factor. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 103-7620-001_E. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Thanks to this standard, conduction cooled boards and chassis selected Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. Curtiss Wright. 8 in. 2) modules. PXI / PXIe Chassis. 3) CompactPCI Serial is an industrial standard for modular computer systems. VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. 3U/6U High ATR Chassis with upto 15 Slots Card Area. Kontron's standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. Systems Integrators can plug the VME-680 into their VME64x chassis and focus on architecting their network through one of may intuitive management interfaces (Table 3) and (Figure 5). 3-n. Rhino - 3U/6U Conduction Cooled. 8” slot. 2. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion. Conduction cooling is defined as the transfer of heat through solids. The Isothermal Card Edge (ICE)-Lok® is designed to enhance thermal performance for conduction-cooled embedded computing systems. It is conduction-cooled through the card edge/wedgelock. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. In addition to rugged enclosures, we also offer a range of development platforms for the latest technologies such as OpenVPX. 8 in. Rackmount 19” chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. It can be installed in any standard conduction cooled VME chassis. The PSC-6236 features a mission critical wide temperature range at high power on a 1 inch pitch. 3U/6U (VPX / cPCI/ VME) Backplane Options. About - 1-ACT. Additionally, full military-grade conduction cooled requirements can also be accommodated with Elma’s. A means to utilize conduction-cooled VME electronics mod ules in an air cooled system is provided. About. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. 10/. Configuration: • System Power: 400W. The…. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. High Quality Chassis and Enclosures for High Speed CompactPCI Serial Applications (up to PCIe Gen. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. 3 V. 05 G2/Hz-IS to $5_C 2 (,]o_) Table I -DSS Requirements Summary A block diagram of the DSS is shown in Figure 4. The ICE-Lok® thermally enhanced Wedge. ATR Size : Max 6U Slots : 1/2 Short : 5 : 1/2 Long : 5 :Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. This platform conforms to VITA 1. The VPX3-663 combines a PCIe Gen 3. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Maximum power dissipation depends on cold plate. 0 in. • (3) Ethernet Ports. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. 0 - 7. PSU, open frame, 444 W (400 W at < 180 VAC) Backplane VME 8 slot, 6 U, J1/J2 monolithic in accordance with VITA 1-1994. It is based on the established PICMG 2. 08 of Vita65. Systems Integration Plus, Inc. LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. LCR’s field proven chassis have provided over 30 years of reliable service in a wide array of. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. RuSH controlled power and cooling supports high current demands and corresponding. 0 specification for use in Mil/Aero VPX systems. 6U Card Support (VPX/VME/cPci)- Aurora Chassis. Ideal for highly dense embedded systems with exceptional heat dissipation requirements, the new platform holds 6U conduction cooled boards with a 1" pitch per VITA 48. Boards are inserted in the back of the chassis in a vertical orientation. Up to 128 Gbytes DDR4 memory for server grade applications. Our cardcages conform to DIN 41494 and IE 1101. The ANSI VITA 62 standard defines the mechanical and electrical specifications for commercial-off the shelf plug-in power supply modules in 3U and 6U format. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. 3U / VITA 62 / 400W. 3U 2 Slot OpenVPX Development Chassis. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. Ability to work with existing board, frame, or chassis designs. Motorola – Single board chassis design with natural convection requirement. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. <br /> If you’ve ever dreamed about controlling<br /> your VME system directly from your desk-<br /> top system, your dream. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. VME and VME64x Systems. 600-Watt DC/DC Converter, 6U VME. About. 1ϕ / 3ϕ AC or 28v DC Input power supply (up to 1500w) Input Transients as per MIL-STD-704E / MIL-STD-1275D. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardCan be provided in a range of ATR sizes. GS16. Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. Table top rubber feet. VPX is specified for 3U and 6U boards and for air cooled, conduction cooled and even liquid cooled chassis. 8 slot conduction cooled 3U VPX chassis; 6 SSD removable drive bay; Minimal Cables / Edge Card; Multiple configurations, interfaces, and integrations. CompactPCI Serial Chassis. CompactPCI Serial Chassis. CAD templates and 3D printed prototypes available. Related To: Dawn VME Products 6U VME64x 195-x Mini Chassis. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression Coolers) Enclosure. Heat frames can be designed for compliance with IEEE 1101. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. Conduction Cooled Version of Pixus VPX Chassis Manager. Backplane: Custom 6U, 10 slot open VPX Backplane (Dawn P/N 08-1017654 Rev. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. The card comes standard with LED configuration, a front panel reset switch, and two single-wide PMC slots. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. It is conduction-cooled through the card edge/wedgelock. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. including surveillance, data collection, storage and weapons control. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. The ICE-Lok® can be seamlessly. 0 specification. And with now-available high I/O VPX boards, there will be more PCIe lanes than ever traveling around a VME chassis; that’s why it’s critical to make sure those PCIe lanes. The standard model is conduction to wedge lock. Air-Cooled variants are designed to be used in standard industrial VME chassis. 12”W x 19. • Backplane Slots: 9 VME64x J1/J2 Slots. X-ES embedded 3U VPX Single Board Computers (SBCs) offer unparalleled performance from their cutting-edge Intel® Core™ i7, Intel® Atom™, Intel® Xeon® D, or NXP (formerly Freescale) QorIQ processors. January 25, 2021. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. 1 PICMG 2. 2. Go-No-Go indicators for 12V, 3. EMI/RFI Power Line Filtering. The heat from the internal conduction-cooled modules is. Thermal barrier coatings (TBCs) are a multilayer coating of a combination of low thermal conductivity, high melting-point ceramics and alloy materials. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. downloads. 8” pitch versus a typical 1. card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and. or 1. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the. High-Performance Cooling with 8 fans in Push/Pull. Operating Temperature > 8 slots: 0°C. 20 based. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. All conductive plates and surfaces are typically aluminum. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. 5-slot, 6U OpenVPX (VITA 65) backplane, 1-in pitch. The power supply is thermally attached to the bulkheads for heat removal. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. New High-Density 3U VPX Switches and Chassis Support Dual 100Gb Ethernet, 8x Gen4 PCIe, or 16 LVDS. Built with aluminum the chassis are suitable for rugged airborne applications and can operate in under extreme temperatures, dust and humidity. The C162 is based on Intel’s Calpella (Arrandale + ECC) platform comprising an i7 dual-core/four thread (Intel Hyper-Threading® Technology) processor with large integrated on-chip L1, L2 and shared L3 caches as well as a companion QM57 PCH I/O. Height: 7. Show More Description. The XPand1203 is a low-cost, flexible, development platform. Dawn’s embedded RuSH technology provides intelligence for precision monitoring and control. Even though conduction cooling typically is the least expensive thermal-management approach for rugged systems, it still introduces some costs in the form of metal card edges that conduct heat. Over the evolution of its near 40 years of existence,. DEV. Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. 600-Watt DC/DC Converter, 6U VME. VITA 62 Compliant 3U VPX power supply. Show More Description. With moveable rear profiles (up to 2. Input Transients as per MIL-STD-704E / MIL-STD-1275D. Designed for rugged conduction cooled assemblies (CCAs) in VPX systems,. The entire liquid conduction cooled chassis is built at our Longmont facility. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. The ATR-5700 uses a microcomputer controlled 600W 6-Channel, VPX power supply that operates at 94% efficiency. A network-attached Flyable Data Loader (FDL). Intel®. or 1. 3/4 ATR, conduction-convection cooled. 0 in. 08/03/20231 ATR Liquid Cooled : Extended Description: This modular design ATR holds conduction cooled modules with independent dual liquid cooled side walls and a field-proven High Integrity Frame construction. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. With the VPX3-663, designers can create switched networks that allow any module in the system to connect to any. Min. LCR’s field proven chassis have provided over 30 years of reliable service in a wide array of. • Drive Bay: None Installed. Conduction cooled base coupled, via short and effi cient thermal path, provides for optimum cooling. They are low-power system-on-chip (SoC. Revolutionary design allows for up to 175 watts per slot of conduction cooling. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. 3V. 2-7. Subrack based, sheet metal, desktop or tower configurations. 0 specification for use in Mil/Aero VPX systems. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. Intel® Xeon® D-1500 Family Processor-Based Conduction- or Air-Cooled 6U VME SBC. 2 restricts air flow to the card edges where it’s cooling impact is limited and so conduction cooling and air cooling solutions are usually considered mutually exclusive. The convection bridge is clamped between the VME. MS216479+RC. 8 designs, he says. 3 V. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. Shutdown control for each power rail. PSC-6236 Product DatasheetLiquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. 3"H Chassis Cooling: Conduction-Cooled Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/OTR MAx/6sd-RCx – Rugged 3U VPX Plug In Card. 2, AMC. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. Conduction cooling moves the heat from the printed board through a heat transfer surface to the chassis walls and structure where the air circulating nearby removes the heat. The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Heat frames can be designed for compliance with many industry standards. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. PXI Express Chassis. – September 21, 2010 – Dawn VME Products, a leading designer and manufacturer of high performance and reliable embedded packaging technology products based on the VITATM and PICMG® architectures, announces its CCE-3VX4 ruggedized 4 slot conduction cooled enclosure for VPX 3U modules, the VPX. {1/2 Slot, 3/4 Slot, Full Slot ATR VME Enclosures MIL [Military]/Rugged, conduction cooled} American Rugged Enclosures 'ARE' {SEM E, Conduction Cooled ATR Chassis, 3 - 21 Slots} CM Computer {5/7/12 Slot ATR chassis supporting VME32 and VME64x backplanes, 1/2, 3/4, 1 ATR Long size} Curtiss Wright. 8” slot. 0 specification for use in. manufactures a variety of rugged modular conduction cooled chassis as well as 19” and 19” 1/2 form factor enclosures and a full range of 3U and 6U COTS modules for VPX , VITA 73 and CPCI applications. 3V_Aux. 1/2 ATR, conduction-convection cooled. 62” deep without handle) Customized Front Input/Output (I/O) Panel; Connector layout per customer requirement (option per MIL-DTL-M38999) Meets MIL-STD-810F for. 10 Mechanical standards; 6U (VXS/ OpenVPX/VPX/VME64x / cPCI) Backplane Options; 1U to 11U High Card Area; 2 to 21 Slots; Custom specific Switch Controls and indications; Forced Air Convection Cooled; AC / DC Input power supply; EMI/RFI. Load sharing circuitry for up to 4 modules. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. 3U/6U Short/Short, Short/Long, Tall/Short, Tall/Long & Dwarf to 1 ½ ATR Chassis. 600-Watt DC/DC Converter, 6U VME. Paper ID: SR22628105125 DOI: 10. See Details. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Single/dual cooled side walls. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. This 5 slot Hartmann VPX 4U system chassis provides an intelligent, practical packaging solution for high-performance processors. 0 in. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. Subrack based, sheet metal, desktop or tower configurations. CompactPCI Serial Chassis. For a chassis with sealed side walls and lid. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 10. 3U CompactPCI 2. Chassis. 3V/25A, 5V/20A, 12V_AUX/1. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 0 specification for use in Mil/Aero VPX systems. VPX combines best-in-class technologies to assure a very long technology cycle. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. PXI Express Chassis. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O. Chassis is capable to provide withstand Shock and Vibration defined by MIL-STD-810 as followed: - Shock: 40G in both Positive and. nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. C: 70 Input 28VDC: 1. 5mm) to 1. Power Supplies. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Wire-free design. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. Power and reset LEDs are provided for. 0 in. It is conduction-cooled through the card edge/wedgelock. 2-16 VPX slots at 1” pitch. At ACT, we work with our customers to find the best options to reduce conduction gradients and meet. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in. Aitech Defense Systems Inc. 2) modules. For all rugged environments: Air, Land, and Sea. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in VPX, VME and CompactPCI systems. Both managed and unmanaged versions are available to support air-cooled and rugged conduction-cooled defense and aerospace applications. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. With features ranging from integrated FPGAs to SecureCOTS™ technology for protecting data from observation or modification to. or 1. Form Factor: 6U VME Processor: NXP QorIQ T2080 Memory: 8 GB DDR3 Ethernet: 8 10/100/1000BASE-T USB: 1 USB 2. 2. Files (3) VPX VITA CARD 3U /. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. Dawn’s VITA 62 compliant 6U PSC-6265 can operate continuously in diverse environments over a wide range of temperatures at high power levels. The newest VITA specification is VPX. RuSH enhanced 3u conduction cooled power supply Wedge-lock style card guides to support conduction cooled boards available as an option. RME-6430 7U 19” Rack Mount Enclosure for 3U VPX. Advanced airflow design distributes air across external fins in sidewalls. 3V_AUX/6A (from VS2) Power Supply Type: VPX / 600W, VPX power supply Ruggedized, air cooled. Communications Intelligence (Ground Mobile) SIP designs communication and signals intelligence computers for rugged ground mobile applications. ATR, rugged, air- and conduction-cooled, Integrated Systems} kontron {VME Rugged-Standard-3 to 18 slot} MacroLink Inc. Hartmann is able to deliver a more rugged 19” solution when compared to the standard, as necessary or desired. The Curtiss-Wright Defense Solutions rugged, conduction-cooled, network centric flight control and management computer is designed to operate in a rugged UAV environment and provides a total flight control solution backed by substantial technical maturity and heritage. With moveable rear profiles (up to 2. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow customization of. Victoria BC : 250-727-2890 ©2010 A&A Perfomance Chassis: Site Design by. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. ACT offers a variety of innovative heat pipe HVAC solutions that will take a big bite out of your energy bills and provide a rapid return on your initial. Different widths and combinations of 3 and 6U slots are available also. Utilizing our extensive experience in embedded. CP931. Description. 6U / VITA 62 / 580W. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. VITA46, VITA48 (VPX REDI) and VITA65 (Open VPX) ready accessories, backplanes, development chassis, power supplies, enclosures and rack mounts. 0 specification for use in. from ELMA Electronic Inc. CompactPCI Serial Chassis. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. Five slots 3U VPX conduction cooled Chassis. VME64x 2U/84HP 4 Slots. 3 and/or AMC. 1 inch (2. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. With 6U-VME conduction cooling, power dissipation per slot is limited by the cold plate on which the chassis is mounted. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. PXI /. Learn About Us. (W) x 5. The Ruggedized Enhanced Design Implementation (VPX. 6″ form factor. PSC-6234 3U 400-Watt 6-channel plug-in or bulkhead mounted Power Supply for conduction cooled OpenVPX systems. VME Chassis is a Metallic box or enclosure which normally contains VME Backplane, cooling systems like fans and Power supply unit like SMPS. Because VITA 48. Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses;. The XPand1303 is a low-cost, flexible, development platform. . 8 in. Utilizing our extensive experience in embedded. Thermal design, simulation and analysis services. 20 dimensions for conduction cooling, and meets the VITA 47 ECC4 ruggedization specifications for shock, vibration, and operating temperature range of -40° C to +85° C. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1″ pitch per VITA 65 Backplane Profile BKP6-CEN07-11. The system is designed with enhanced EMC features. 1, IEEE 1101. The heat from the internal conduction-cooled. 4+ years of experience assisting electromechanical and mechanical applications. (COTS) and customized conduction. A well-designed HVAC energy recovery heat pipe system will provide effective and affordable energy recovery during the hot summer and cold winter months as well as throughout the year. To suit 3U & 6U card sizes. face of the chassis, the area most likely to be damaged if the unit is accidentally dropped.